ADVANCED COMPREHENSIVE CLEANING
ACROSS THE ENTIRE WAFER
THOROUGH, GENTLE, DAMAGE-FREE
EVEN FOR DELICATE 3D STRUCTURES
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Smart Megasonix
The Industry’s Most Advanced Wafer Cleaning
Technologies. Only from ACM.
  • Smarter
    Megasonic
    Cleaning

  • For Advanced
    2D and 3D
    Devices

  • Thorough
    Wafer-wide
    Cleaning

  • Gentler
    Damage-free
    Cleaning

  • Reducing
    Defects, Raising
    Yields

This is the next generation of megasonic wafer cleaning, an advanced and innovative suite of technologies utilizing smarter, more comprehensively controlled megasonic techniques.    Exclusively from ACM, Smart Megasonix™ technologies enable a much more thorough megasonic wafer cleaning — and at the same time, a much more gentle cleaning — than previous technologies.    And this delivers higher yields and increased profits.  •  Smart Megasonix is able to fully and efficiently clean both 2D and 3D patterned wafers with features too small to be addressed by conventional jet spray or conventional megasonic processes.    The proprietary ACM technologies effectively remove smaller killer defects, even on very small devices and on structures with very high aspect ratios.    This is smarter megasonic wafer cleaning from ACM. Regardless of your current processing node, ACM’s special Smart Megasonix is designed to address the advanced wafer cleaning requirements of today — and those coming tomorrow.